Mechanical Engineer Student
- Company: Nokia
- Location: Ottawa, Ontario, Canada
- Work mode: On-site
- Job type: Full-Time
- Posted: 2026-10-29
JOB DESCRIPTION
Position: Mechanical Engineer Student
Number of Position(s): 1
Duration: 4 Months
Start Date: January 4, 2027
Location: Onsite - Ottawa, Canada
Educational Recommendations: Currently enrolled in a mechanical engineering program with an accredited school in Canada.
In this role, you will collaborate with a world-class team of engineers to support the design, modeling, and testing of advanced optical technologies. This position offers a unique opportunity to balance thermal, structural, and manufacturability requirements while gaining hands-on experience in CAD design, Finite Element Analysis (FEA), thermal modeling, and New Product Introduction (NPI) processes. You will work cross-functionally across global locations to help transition innovative concepts into reliable, high-performance products.
RESPONSIBILITIES
* Support the mechanical design of optical pluggable modules.
* Review CAD models, detailed drawings, and conduct tolerance and stress analyses.
* Perform thermal and mechanical design verification testing (DVT) and assemble prototypes.
* Support the transition of designs to production with minimal redesign.
* Interface with suppliers/contract manufacturers to resolve integration issues.
* Author Engineering Change Orders (ECOs) and Bills of Materials (BOMs).
* Define and validate labeling, packaging, and regulatory compliance requirements.
* Partner with electrical, optical, manufacturing, and test teams to propose innovative solutions that improve product performance, cost, and reliability.
* Assist with root-cause analysis of field issues and support ongoing engineering efforts.
QUALIFICATIONS
You're a great fit if you have:
* Experience with optical transceiver packaging (e.g., QSFP, OSFP) and ASIC packaging.
* Knowledge of compliance, shock, and vibration testing for telecommunications applications.
* Familiarity with advanced substrate technologies (e.g., organic build-up, LTCC, HTCC, and high-performance PCB laminates).
* Basic knowledge of thermal modeling, FEA, and CAD design tools.